SSH IEC 60749-14:2003

Pajisje gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 14: Shtangësia e fundeve të linjave (integriteti i përcjellësit)

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Publication date: 5 dhj 2011

General information

Current stage: 60.60 Effective date: 5 dhj 2011

Originator: DPS

Owner: DPS/KT 7

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Publikuar

PDF - 3 748 Lekë

Paper - 3 748 Lekë

CD - 3 748 Lekë

PDF and Paper - 7 496 Lekë

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Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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PUBLISHED
SSH IEC 60749-14:2003
60.60 Standard published
5 dhj 2011

SSH IEC 60749-14:2003

Pajisje gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 14: Shtangësia e fundeve të linjave (integriteti i përcjellësit)

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

General information

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Scope

Life cycle

NOW

Related project

Adopted from IEC 60749-14:2003 ED1 IDENTICAL

Adopted from IEC 60749-14 Ed. 1.0 b