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IEC 60749-14:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
7 gush 2003

General information

60.60     7 gush 2003

IEC

TC 47

International Standard

31.080.01  

anglisht   frëngjisht   spanjisht  

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Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62184:2000 ED1

NOW

PUBLISHED
IEC 60749-14:2003 ED1
60.60 Standard published
7 gush 2003