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SSH IEC 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Dec 5, 2011

General information

60.60     Dec 5, 2011

DPS

DPS/KT 7

International Standard

31.080.01  

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Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Life cycle

NOW

PUBLISHED
SSH IEC 60749-14:2003
60.60 Standard published
Dec 5, 2011

Related project

Adopted from IEC 60749-14:2003 ED1 IDENTICAL

Adopted from IEC 60749-14 Ed. 1.0 b