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SSH EN 60191-6-13:2007

SStandardizimi mekanik i pajisjeve gjysmëpërçuese - Pjesa 6-13: Udhëzim projektimi për prizat pa kapak për paketën matricore të rrjetit me imazh me topa me shumë pak lartësi dhe për paketën matricore të rrjetit me imazh me katrorë me shumë pak lartësi (FBGA/FLGA)

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
14 gush 2008
95.99 Withdrawal of Standard   18 shk 2020

General information

95.99     18 shk 2020

DPS

DPS/KT 7

European Norm

31.080.01  

anglisht  

Buying

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Scope

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ('FBGA' hereafter) and Fine-pitch Land Grid Array ('FLGA' hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

Life cycle

NOW

WITHDRAWN
SSH EN 60191-6-13:2007
95.99 Withdrawal of Standard
18 shk 2020

REVISED BY

PUBLISHED
SSH EN 60191-6-13:2016

Related project

Adopted from EN 60191-6-13:2007

Adopted from IEC 60191-6-13 Ed. 1.0 b