This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ('FBGA' hereafter) and Fine-pitch Land Grid Array ('FLGA' hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
WITHDRAWN
SSH EN 60191-6-13:2007
95.99
Withdrawal of Standard
Feb 18, 2020
PUBLISHED
SSH EN 60191-6-13:2016
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