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Wind energy generation systems - Part 15-2: Framework for assessment and reporting of the wind resource and energy yield
10.60 Close of voting
Technical Specification for Harmonic Evaluation of Offshore Wind Farms Grid-connected via VSC-HVDC
10.20 New project ballot initiated
Roadmap of grid integration of renewable energy generation
00.00 Proposal for new project received
Grid-forming technology and applications in renewable energy dominated power systems
00.00 Proposal for new project received
Business Use Cases (BUCs) of Flexibility Services
10.20 New project ballot initiated
Primary Frequency Coordinated Control Framework of System with High Penetration of Inverter Based Generation
00.00 Proposal for new project received
Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
10.20 New project ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
10.20 New project ballot initiated
Sintering assembly technology - Part 1: Generic description
10.20 New project ballot initiated
Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
10.20 New project ballot initiated
Thermography test method for printed circuit interconnection defects
10.20 New project ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
10.20 New project ballot initiated
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
10.20 New project ballot initiated
Thermal Endurance Test Method for Flexible Optic-Electric Circuit
00.99 Approval to ballot proposal for new project
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