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IEC 61189-3:1997/AMD1:1999 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
29 korr 1999

General information

99.60     9 tet 2007

IEC

TC 91

International Standard

31.180  

anglisht   frëngjisht  

Buying

Revised

Language in which you want to receive the document.

Scope

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61189-3:1997 ED1

NOW

WITHDRAWN
IEC 61189-3:1997/AMD1:1999 ED1
99.60 Withdrawal effective
9 tet 2007

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2