IEC 61189-3:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Publication date: 27 nën 2006

General information

Current stage: 99.60 Effective date: 9 tet 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 101 763 Lekë

Paper - 101 763 Lekë

CD - 101 763 Lekë

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Language in which you want to receive the document.

Scope

Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for
manufacturing interconnection structures (printed boards) and
assemblies. It mainly covers chemical, mechanical and electrical
test methods.

Life cycle

NOW

WITHDRAWN
IEC 61189-3:1997 ED1
99.60 Withdrawal effective
9 tet 2007

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 61189-3:1997/AMD1:1999 ED1

ABANDON
IEC 61189-3/AMD2 ED1

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2