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IEC 61189-3:1997/AMD1:1999 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Jul 29, 1999

General information

99.60     Oct 9, 2007

IEC

TC 91

International Standard

31.180  

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WITHDRAWN
IEC 61189-3:1997 ED1

NOW

WITHDRAWN
IEC 61189-3:1997/AMD1:1999 ED1
99.60 Withdrawal effective
Oct 9, 2007

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2