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IEC TR 62240-1:2013 ED1

Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
23 pri 2013

General information

99.60     13 mar 2018

IEC

TC 107

Technical Report

03.100.50     31.020     49.060  

anglisht   rusisht  

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Scope

IEC/TR 62240-1:2013(E) provides information for the use of semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers' specifications. This technical report describes the methods and processes for implementing this special case. All of the elements of these methods and processes employ existing, commonly used best engineering practices. IEC/TR 62240-1 includes the following significant changes with respect to IEC/TR 62240:
- revised wording, clarifications and corrections;
- removal of all requirements;
- updated paragraphs, including addition of references to the utilization of samples from a single lot, and the fact that performance of uprating is repeated if significant changes are implemented by device manufacturer, as well as the reference that the manufacturer's warranty may be eliminated if uprating is performed.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC TR 62240:2005 ED1

NOW

WITHDRAWN
IEC TR 62240-1:2013 ED1
99.60 Withdrawal effective
13 mar 2018

REVISED BY

PUBLISHED
IEC TR 62240-1:2018 ED2