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IEC 60249-2-13:1987/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
18 maj 1993
95.99 Withdrawal of Standard   15 tet 2004

General information

95.99     15 tet 2004

IEC

TC 91

International Standard

31.180  

anglisht   frëngjisht   spanjisht  

Buying

Replaced

Language in which you want to receive the document.

Scope

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60249-2-13:1987 ED1

NOW

WITHDRAWN
IEC 60249-2-13:1987/AMD1:1993 ED1
95.99 Withdrawal of Standard
15 tet 2004

REVISED BY

PUBLISHED
IEC 61249-2-13:1999 ED1