IEC 60249-2-13:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Publication date: 30 sht 1987

95.99 Withdrawal of Standard 15 tet 2004

General information

Current stage: 95.99 Effective date: 15 tet 2004

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Replaced

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

Language

Language in which you want to receive the document.

Scope

Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier.
The material consists of an insulating flexible film base with copper foil bonded to one or both sides, with or without the use of an adhesive.

Life cycle

NOW

WITHDRAWN
IEC 60249-2-13:1987 ED1
95.99 Withdrawal of Standard
15 tet 2004

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60249-2-13:1987/AMD1:1993 ED1

REVISED BY

PUBLISHED
IEC 61249-2-13:1999 ED1