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IEC 60249-2-13:1987/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Publication date: May 18, 1993

95.99 Withdrawal of Standard Oct 15, 2004

General information

Current stage: 95.99 Effective date: Oct 15, 2004

Originator: IEC

Owner: TC 91

Type: International Standard

Languages: English French Spanish

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Status: Replaced

PDF - ALL 1,131

Paper - ALL 1,131

CD - ALL 1,131

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Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60249-2-13:1987 ED1

NOW

WITHDRAWN
IEC 60249-2-13:1987/AMD1:1993 ED1
95.99 Withdrawal of Standard
Oct 15, 2004

REVISED BY

PUBLISHED
IEC 61249-2-13:1999 ED1