IEC 60191-5:1997 ED2

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Publication date: 23 pri 1997

General information

Current stage: 60.60 Effective date: 23 pri 1997

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 28 268 Lekë

Paper - 28 268 Lekë

CD - 28 268 Lekë

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Scope

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60191-5:1987 ED1

NOW

PUBLISHED
IEC 60191-5:1997 ED2
60.60 Standard published
23 pri 1997

National adoptions

SSH IEC 60191-5:1997

DPS

Standardizimi mekanik i pajisjeve gjysmëpërçuese - Pjesa 5: Rekomandime aplikimi për paketat e qarqeve të integruara që përdorin transferimin automatik në kasetë (TAB)

60.60 Standard published

DPS/KT 7 më tepër