DPS
Drejtoria e Përgjithshme e Standardizimit
0 Produkte
Llogaria ime
E-albania
Tel/Cel: +355 4 222 62 55
E-mail: info@dps.gov.al
Adresa: Rr.: "Reshit Collaku", (pranë ILDKPKI, kati VI), Kutia Postare 98, Tiranë - Shqipëri
Main menu

IEC 60191-5:1987 ED1

Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.
15 sht 1987

General information

99.60     23 pri 1997

IEC

TC 47/SC 47D

International Standard

31.080.01  

anglisht   frëngjisht   rusisht  

Buying

Revised

Language in which you want to receive the document.

Scope

Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards.
Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to additional or new dimensions.

Life cycle

NOW

WITHDRAWN
IEC 60191-5:1987 ED1
99.60 Withdrawal effective
23 pri 1997

REVISED BY

PUBLISHED
IEC 60191-5:1997 ED2