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IEC 60191-5:1997 ED2

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Apr 23, 1997

General information

60.60     Apr 23, 1997

IEC

TC 47/SC 47D

International Standard

31.080.01  

English   French  

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Published

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Scope

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60191-5:1987 ED1

NOW

PUBLISHED
IEC 60191-5:1997 ED2
60.60 Standard published
Apr 23, 1997

National adoptions

SSH IEC 60191-5:1997  
DPS

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

60.60 Standard published

DPS/KT 7 more