SSH IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Publication date: Dec 7, 2017

General information

Current stage: 60.60 Effective date: Sep 8, 2017

Originator: DPS

Owner: DPS/KT 7

Type: International Standard

ICS: 31.080.01

Languages: English

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Status: Published

PDF - ALL 4,403

Paper - ALL 4,403

CD - ALL 4,403

PDF and Paper - ALL 8,806

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Scope

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

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PUBLISHED
SSH IEC 60191-5:1997
60.60 Standard published
Sep 8, 2017

SSH IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from IEC 60191-5:1997 ED2 IDENTICAL

Adopted from IEC 60191-5 Ed. 2.0 b