IEC PAS 60191-6-18:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publication date: 22 jan 2008

General information

Current stage: 99.60 Effective date: 7 jan 2010

Originator: IEC

Owner: TC 47/SC 47D

Type: Publicly Available Specification

ICS: 31.080.01

Gjuha: anglisht

Buying

Statusi: Replaced

PDF - 13 003 Lekë

Paper - 13 003 Lekë

CD - 13 003 Lekë

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Scope

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

Life cycle

NOW

WITHDRAWN
IEC PAS 60191-6-18:2008 ED1
99.60 Withdrawal effective
7 jan 2010

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60191-6-18:2010/COR1:2010 ED1

PUBLISHED
IEC 60191-6-18:2010/COR2:2010 ED1

REVISED BY

PUBLISHED
IEC 60191-6-18:2010 ED1