IEC PAS 60191-6-18:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publication date: Jan 22, 2008

General information

Current stage: 99.60 Effective date: Jan 7, 2010

Originator: IEC

Owner: TC 47/SC 47D

Type: Publicly Available Specification

ICS: 31.080.01

Languages: English

Buying

Status: Replaced

PDF - ALL 13,003

Paper - ALL 13,003

CD - ALL 13,003

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Scope

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

Life cycle

NOW

WITHDRAWN
IEC PAS 60191-6-18:2008 ED1
99.60 Withdrawal effective
Jan 7, 2010

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60191-6-18:2010/COR1:2010 ED1

PUBLISHED
IEC 60191-6-18:2010/COR2:2010 ED1

REVISED BY

PUBLISHED
IEC 60191-6-18:2010 ED1