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IEC 60191-6-18:2010/COR1:2010 ED1

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

General information

60.60     May 31, 2010

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60191-6-18:2010 ED1

NOW

PUBLISHED
IEC 60191-6-18:2010/COR1:2010 ED1
60.60 Standard published
May 31, 2010