IEC 60191-6-18:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publication date: 7 jan 2010

General information

Current stage: 60.60 Effective date: 7 jan 2010

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.

The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 60191-6-18:2008 ED1

NOW

PUBLISHED
IEC 60191-6-18:2010 ED1
60.60 Standard published
7 jan 2010

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60191-6-18:2010/COR1:2010 ED1

PUBLISHED
IEC 60191-6-18:2010/COR2:2010 ED1