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IEC 61249-2-55 ED1

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

General information

20.99     10 jan 2025

CD    30 sht 2025

IEC

TC 91

International Standard

31.180  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 61249-2-55 ED1
20.99 WD approved for registration as CD
10 jan 2025