Materials for printed boards and other interconnecting structures -<br />
Part 2-XX: Reinforced base materials clad and unclad -<br />
Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
General information
10.6015 nën 2024
IEC
TC 91
International Standard
Scope
Life cycle
NOW
IN_DEVELOPMENT PNW 91-1980 ED1 10.60
Close of voting 15 nën 2024