IEC TR 63378-1:2021 ED1

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Publication date: 14 dhj 2021

General information

Current stage: 60.60 Effective date: 14 dhj 2021

Originator: IEC

Owner: TC 47/SC 47D

Type: Technical Report

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Publikuar

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Scope

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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PUBLISHED
IEC TR 63378-1:2021 ED1
60.60 Standard published
14 dhj 2021

National adoptions

DS IEC TR 63378-1:2021 ED1

DPS

Standardizimi termik në paketat e gjysmëpërçuesit - Pjesa 1: Rezistenca termike dhe parametri termik i paketave gjysmëpërçuese të tipit BGA, QFP

60.60 Standard published

DPS/KT 7 më tepër

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