IEC TR 63378-1:2021 ED1

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Publication date: Dec 14, 2021

General information

Current stage: 60.60 Effective date: Dec 14, 2021

Originator: IEC

Owner: TC 47/SC 47D

Type: Technical Report

ICS: 31.080.01

Languages: English

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Status: Published

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IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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PUBLISHED
IEC TR 63378-1:2021 ED1
60.60 Standard published
Dec 14, 2021

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DS IEC TR 63378-1:2021 ED1

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Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

60.60 Standard published

DPS/KT 7 more

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