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DS IEC TR 63378-1:2021 ED1

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Sep 7, 2023

General information

60.60     Sep 7, 2023

95.99   

DPS

DPS/KT 7

Technical Report

31.080.01  

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Scope

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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PUBLISHED
DS IEC TR 63378-1:2021 ED1
60.60 Standard published
Sep 7, 2023

Related project

Adopted from IEC TR 63378-1:2021 ED1