DS IEC TR 63378-1:2021 ED1

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Publication date: Sep 7, 2023

General information

Current stage: 60.60 Effective date: Sep 7, 2023

Next stage: 95.99

Originator: DPS

Owner: DPS/KT 7

Type: Technical Report

ICS: 31.080.01

Languages: English

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Status: Published

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Scope

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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PUBLISHED
DS IEC TR 63378-1:2021 ED1
60.60 Standard published
Sep 7, 2023

Related project

Adopted from IEC TR 63378-1:2021 ED1

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