IEC 63378-3:2025 ED1

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Publication date: 6 maj 2025

General information

Current stage: 60.60 Effective date: 6 maj 2025

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 9 046 Lekë

Paper - 9 046 Lekë

CD - 9 046 Lekë

Language

Language in which you want to receive the document.

Scope

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

Life cycle

NOW

PUBLISHED
IEC 63378-3:2025 ED1
60.60 Standard published
6 maj 2025