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IEC 63378-3 ED1

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

General information

50.99     Aug 9, 2024

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-3 ED1
50.99 FDIS or proof approved for publication
Aug 9, 2024