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IEC 63378-3:2025 ED1

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

May 6, 2025

General information

60.60     May 6, 2025

IEC

TC 47/SC 47D

International Standard

31.080.01  

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Scope

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

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PUBLISHED
IEC 63378-3:2025 ED1
60.60 Standard published
May 6, 2025