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SSH EN IEC 63378-3:2025

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

Sep 9, 2026

General information

60.60     Sep 9, 2026

95.99   

DPS

DPS/KT 7

European Norm

31.080.01  

English  

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Scope

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.

This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

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PUBLISHED
SSH EN IEC 63378-3:2025
60.60 Standard published
Sep 9, 2026

Related project

Adopted from EN IEC 63378-3:2025 IDENTICAL

Adopted from IEC 63378-3:2025 ED1 IDENTICAL