Materialet për strukturat e interkonjeksionitPjesa 8: Komplet i specifikimeve sektoriale për mbulesat dhe shtresat jo përcjellëseSeksioni 8: Mbulesat polimere të përkohëshme
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
Life cycle
NOW
PUBLISHED SSH EN 61249-8-8:1997 60.60
Standard published 1 jan 2006