SSH EN 61249-8-8:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Publication date: Aug 30, 2006

General information

Current stage: 60.60 Effective date: Jan 1, 2006

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.180

Languages: English

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Status: Published

PDF - ALL 2,261

Paper - ALL 2,261

CD - ALL 2,261

PDF and Paper - ALL 4,522

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Scope

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

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PUBLISHED
SSH EN 61249-8-8:1997
60.60 Standard published
Jan 1, 2006

SSH EN 61249-8-8:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN 61249-8-8:1997

Adopted from IEC 61249-8-8 Ed. 1.0 b