Pajisje gjysëmpërçuese - Pajisje mikroelektromekanike - Pjesa 16: Metodat e provës për përcaktimin e tensionit të mbetur të shtresave MEMS - Metodat e thyerjes së rrezes së panelit dhe devijimi i trarit te elementi i varur
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Life cycle
NOW
PUBLISHED SSH EN 62047-16:2015 60.60
Standard published 10 qer 2016
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