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SSH IEC 60749-19:2003/A1:2010

Amendament 1 - Pajisje gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 19: Rezistenca ndaj prerjes së stampës

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
5 dhj 2011

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60.60     5 dhj 2011

DPS

DPS/KT 7

International Standard

31.080.01  

anglisht  

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SSH IEC 60749-19:2003/A1:2010
60.60 Standard published
5 dhj 2011

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Adopted from IEC 60749-19:2003/AMD1:2010 ED1 IDENTICAL

Adopted from IEC 60749-19 Amd.1 Ed. 1.0 b