Standardizimi mekanik i pajisjeve të gjysmëpërçuesve - Pjesa 6-21: Rregulla të përgjithshme për përgatitjen e skicave të kutive për pajisjet e gjysëmpërçuesve që montohen në sipërfaqe - Metodat e matjes për përmasat e kutive të vogla të skicuara (SOP)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Life cycle
NOW
PUBLISHED SSH EN 60191-6-21:2010 60.60
Standard published 25 pri 2011
Related project
Adopted from
EN 60191-6-21:2010
Adopted from
IEC 60191-6-21 Ed. 1.0 b
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