Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Life cycle
NOW
PUBLISHED SSH EN 60191-6-21:2010 60.60
Standard published Apr 25, 2011
Related project
Adopted from
EN 60191-6-21:2010
Adopted from
IEC 60191-6-21 Ed. 1.0 b
Preview
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.
Shqip