Standardizimi mekanik i pajisjeve gjysmëpërçuese - Pjesa 6-19: Metodat e matjes së përkuljes së paketës në temperaturë të lartë dhe përkulja maksimale e lejuar
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
Life cycle
NOW
PUBLISHED SSH EN 60191-6-19:2010 60.60
Standard published 1 jan 2010
Related project
Adopted from
EN 60191-6-19:2010
Adopted from
IEC 60191-6-19 Ed. 1.0 b
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