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SSH EN 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Oct 21, 2010

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60.60     Jan 1, 2010

DPS

DPS/KT 7

European Norm

31.080.01  

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IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

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PUBLISHED
SSH EN 60191-6-19:2010
60.60 Standard published
Jan 1, 2010

Related project

Adopted from EN 60191-6-19:2010

Adopted from IEC 60191-6-19 Ed. 1.0 b

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