Standardizimi mekanik i pajisjeve gjysmëpërçuese - Pjesa 6-18: Regulla të përgjithshme për përgatitjen e skicave të paketave të pajisjeve gjysëmpërçuese që montohen në sipërfaqe - Udhëzues për projektimin e kutisë matricore me topë (BGA)
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
Life cycle
NOW
PUBLISHED SSH EN 60191-6-18:2010 60.60
Standard published 1 jan 2010
Related project
Adopted from
EN 60191-6-18:2010
Adopted from
IEC 60191-6-18 Ed. 1.0 b
Preview
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.
English