SSH EN 60191-6-18:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publication date: Oct 21, 2010

General information

Current stage: 60.60 Effective date: Jan 1, 2010

Originator: DPS

Owner: DPS/KT 7

Type: European Norm

ICS: 31.080.01

Languages: English

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Status: Published

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Scope

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Life cycle

NOW

PUBLISHED
SSH EN 60191-6-18:2010
60.60 Standard published
Jan 1, 2010

Related project

Adopted from EN 60191-6-18:2010

Adopted from IEC 60191-6-18 Ed. 1.0 b

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