SSH EN 61191-3:1998

Nyjet e paneleve të stampuar - Pjesa 3: Sspecifikimi sektorial - Kërkesat për nyjet e salduara me montim me vrima të tejpërtejme

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publication date: 30 gush 2006

95.99 Withdrawal of Standard 19 pri 2023

General information

Current stage: 95.99 Effective date: 19 pri 2023

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.240

Gjuha: anglisht

Buying

Statusi: Shfuqizuar

PDF - 2 915 Lekë

Paper - 2 915 Lekë

CD - 2 915 Lekë

PDF and Paper - 5 830 Lekë

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Scope

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Life cycle

NOW

WITHDRAWN
SSH EN 61191-3:1998
95.99 Withdrawal of Standard
19 pri 2023

SSH EN 61191-3:1998

Nyjet e paneleve të stampuar - Pjesa 3: Sspecifikimi sektorial - Kërkesat për nyjet e salduara me montim me vrima të tejpërtejme

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

95.99 Withdrawal of Standard 19 pri 2023

General information

Buying

Scope

Life cycle

NOW

REVISED BY

Related project

Adopted from EN 61191-3:1998

Adopted from IEC 61191-3 Ed. 1.0 b