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SSH EN 61191-3:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Aug 30, 2006
95.99 Withdrawal of Standard   Apr 19, 2023

General information

95.99     Apr 19, 2023

DPS

DPS/KT 4

European Norm

31.240  

English  

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Scope

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Life cycle

NOW

WITHDRAWN
SSH EN 61191-3:1998
95.99 Withdrawal of Standard
Apr 19, 2023

REVISED BY

PUBLISHED
SSH EN 61191-3:2017

Related project

Adopted from EN 61191-3:1998

Adopted from IEC 61191-3 Ed. 1.0 b