SSH EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publication date: Jun 25, 2018

General information

Current stage: 60.60 Effective date: Jan 25, 2018

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.240

Languages: English

Buying

Status: Published

PDF - ALL 3,570

Paper - ALL 3,570

CD - ALL 3,570

PDF and Paper - ALL 7,140

Language

Language in which you want to receive the document.

Scope

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).

This edition includes the following significant technical changes with respect to the previous edition:

a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Life cycle

PREVIOUSLY

WITHDRAWN
SSH EN 61191-3:1998

NOW

PUBLISHED
SSH EN 61191-3:2017
60.60 Standard published
Jan 25, 2018

SSH EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

General information

Buying

Scope

Life cycle

PREVIOUSLY

NOW

Related project

Adopted from EN 61191-3:2017