SSH EN 60749-15:2003

Pajisjet gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 15: Rezistenca ndaj temperaturës së saldimit për pajisjet që montohen në vrima

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Publication date: 18 dhj 2006

95.99 Withdrawal of Standard 4 mar 2014

General information

Current stage: 95.99 Effective date: 4 mar 2014

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Shfuqizuar

PDF - 1 785 Lekë

Paper - 1 785 Lekë

CD - 1 785 Lekë

PDF and Paper - 3 570 Lekë

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Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-15:2003
95.99 Withdrawal of Standard
4 mar 2014

REVISED BY

WITHDRAWN
SSH EN 60749-15:2010

SSH EN 60749-15:2003

Pajisjet gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 15: Rezistenca ndaj temperaturës së saldimit për pajisjet që montohen në vrima

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

95.99 Withdrawal of Standard 4 mar 2014

General information

Buying

Scope

Life cycle

NOW

REVISED BY

Related project

Adopted from EN 60749-15:2003