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SSH EN 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Dec 18, 2006
95.99 Withdrawal of Standard   Mar 4, 2014

General information

95.99     Mar 4, 2014

DPS

DPS/KT 4

European Norm

31.080.01  

English  

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Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-15:2003
95.99 Withdrawal of Standard
Mar 4, 2014

REVISED BY

WITHDRAWN
SSH EN 60749-15:2010

Related project

Adopted from EN 60749-15:2003