SSH EN 61190-1-2:2002

Materialet lidhes për nyjet elektronike - Pjesa 1 - 2: Kërkesat për pastat për ngjitje që përdoren në interkonjeksionet e cilësisë së larte në nyjet elektronike

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Publication date: 1 jan 2006

95.99 Withdrawal of Standard 13 dhj 2012

General information

Current stage: 95.99 Effective date: 13 dhj 2012

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.190

Gjuha: anglisht

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Statusi: Shfuqizuar

PDF - 3 094 Lekë

Paper - 3 094 Lekë

CD - 3 094 Lekë

PDF and Paper - 6 188 Lekë

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Scope

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
SSH EN 61190-1-2:2002
95.99 Withdrawal of Standard
13 dhj 2012

REVISED BY

PUBLISHED
SSH EN 61190-1-2:2007

SSH EN 61190-1-2:2002

Materialet lidhes për nyjet elektronike - Pjesa 1 - 2: Kërkesat për pastat për ngjitje që përdoren në interkonjeksionet e cilësisë së larte në nyjet elektronike

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

95.99 Withdrawal of Standard 13 dhj 2012

General information

Buying

Scope

Life cycle

NOW

REVISED BY

Related project

Adopted from EN 61190-1-2:2002