SSH EN 61190-1-2:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Publication date: Jan 1, 2006

95.99 Withdrawal of Standard Dec 13, 2012

General information

Current stage: 95.99 Effective date: Dec 13, 2012

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.190

Languages: English

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Status: Withdrawn

PDF - ALL 3,094

Paper - ALL 3,094

CD - ALL 3,094

PDF and Paper - ALL 6,188

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Scope

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
SSH EN 61190-1-2:2002
95.99 Withdrawal of Standard
Dec 13, 2012

REVISED BY

PUBLISHED
SSH EN 61190-1-2:2007

SSH EN 61190-1-2:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

95.99 Withdrawal of Standard Dec 13, 2012

General information

Buying

Scope

Life cycle

NOW

REVISED BY

Related project

Adopted from EN 61190-1-2:2002