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SSH EN 61190-1-2:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Mar 26, 2012

General information

60.60     Jul 17, 2012

DPS

DPS/KT 3

European Norm

31.190  

English  

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Scope

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Life cycle

PREVIOUSLY

WITHDRAWN
SSH EN 61190-1-2:2002

NOW

PUBLISHED
SSH EN 61190-1-2:2007
60.60 Standard published
Jul 17, 2012

Related project

Adopted from EN 61190-1-2:2007

Adopted from IEC 61190-1-2 Ed. 2.0 b