SSH EN 60749-20:2003

Pajisjet gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 20: Rezistenca e SMD - ve të futura në material plastik. ndaj efektit të kombinuar të lagështisë dhe nxehtësisë së saldimit

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Publication date: 18 dhj 2006

95.99 Withdrawal of Standard 10 tet 2012

General information

Current stage: 95.99 Effective date: 10 tet 2012

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.080.01

Gjuha: anglisht

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Statusi: Shfuqizuar

PDF - 3 748 Lekë

Paper - 3 748 Lekë

CD - 3 748 Lekë

PDF and Paper - 7 496 Lekë

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Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-20:2003
95.99 Withdrawal of Standard
10 tet 2012

REVISED BY

WITHDRAWN
SSH EN 60749-20:2009

SSH EN 60749-20:2003

Pajisjet gjysëmpërçuese - Metodat e provave mekanike dhe klimatike - Pjesa 20: Rezistenca e SMD - ve të futura në material plastik. ndaj efektit të kombinuar të lagështisë dhe nxehtësisë së saldimit

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

95.99 Withdrawal of Standard 10 tet 2012

General information

Buying

Scope

Life cycle

NOW

REVISED BY

Related project

Adopted from EN 60749-20:2003