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SSH EN 60749-20:2003

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Dec 18, 2006
95.99 Withdrawal of Standard   Oct 10, 2012

General information

95.99     Oct 10, 2012

DPS

DPS/KT 4

European Norm

31.080.01  

English  

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Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-20:2003
95.99 Withdrawal of Standard
Oct 10, 2012

REVISED BY

WITHDRAWN
SSH EN 60749-20:2009

Related project

Adopted from EN 60749-20:2003