Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –<br /> <br /> Part 3-4: Packaging of surface mount components on continuous embossed tapes for Auto Loading Feeder
00.99 Approval to ballot proposal for new project
High-voltage test techniques - Infrared thermal imaging inspection of high-voltage electrical equipment
10.60 Close of voting
Nuclear Power Plants - Instrumentation, control and electrical power systems - Application of simulation techniques
00.00 Proposal for new project received
<p>Electromagnetic compatibility (EMC) – Test method for measuring of transfer impedance Z<sub>T</sub> and screening attenuation a<sub>S</sub> or coupling attenuation a<sub>C</sub> on of connectors and assemblies up to and above 3 GHz -– Triaxial Ttube in tube method</p>
00.99 Approval to ballot proposal for new project
Twinaxial and biaxial cable assemblies for high-speed data communications – Part 1: Generic specification - General requirements and test methods
10.20 New project ballot initiated
Guidance for coupling attenuation and screening attenuation measurement of hybrid cables and assemblies - Triaxial method (IEC 62153-5-x)
00.00 Proposal for new project received
IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew
00.00 Proposal for new project received
Specification of a TD measurement method for twin-axial cables
00.00 Proposal for new project received
Radio-frequency connectors - Part 1-8: Electrical test methods -Voltage standing wave ratio for a single connector by double connector method
00.99 Approval to ballot proposal for new project
<p>Semiconductor devices-Neuromorphic devices - Part 6：Evaluation method of basic characteristics in one transistor one memristor (1T1M) arrays</p>
10.60 Close of voting
<p>Semiconductor devices - Neuromorphic devices - Part 5: Evaluation method of endurance and retention in memristor devices</p>
10.60 Close of voting
Semiconductor devices - Chip-scale testing for autonomous vehicles -Part 3: Thermal imagers
10.20 New project ballot initiated
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 2: Optical performance of LiDAR
10.20 New project ballot initiated
Integrated Circuits - Standard roadmap for chiplet ICs
00.00 Proposal for new project received
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
English