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Radio frequency connectors – Part 1-10: Electrical test methods – Contact resistance
10.20 New project ballot initiated
<p>Semiconductor devices-Neuromorphic devices - Part 6：Evaluation method of basic characteristics in one transistor one memristor (1T1M) arrays</p>
10.20 New project ballot initiated
<p>Semiconductor devices - Neuromorphic devices - Part 5: Evaluation method of endurance and retention in memristor devices</p>
10.20 New project ballot initiated
Semiconductor devices - Chip-scale testing for autonomous vehicles -Part 3: Thermal imagers
10.20 New project ballot initiated
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 2: Optical performance of LiDAR
10.20 New project ballot initiated
Integrated Circuits - Standard roadmap for chiplet ICs
00.00 Proposal for new project received
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components
00.00 Proposal for new project received
Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device
10.60 Close of voting
Test method of sound variation detection sensors for fire detection
00.99 Approval to ballot proposal for new project
Semiconductor devices - Part 14-13: Semiconductor sensors - Performance test methods for spectral sensors
10.60 Close of voting
Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors
10.20 New project ballot initiated
Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools
10.20 New project ballot initiated
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